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Product:Chip - SMD Type  >>  SMD
Model:SMD

1. Characteristic:

·Miniature size

·No lead, ideal for high density SMT installation

·Superior solder ability and resistance to soldering heat

·Ideal for wave or reflow soldering

 

2. Application:

·Temperature compensation of IC, LCD, transistor, crystal
    oscillator of mobile communications equipment

·Temperature sensor for rechargeable batteries

·Temperature sensor for CPU

·Temperature compensation for several kinds of circuits

 

3. Dimension:

Size

L(Length)

W(Width)

0402 (1005)

.04±.006(1.0±0.15)

.02±.004(0.5±0.10)

0603(1608)

.063±.006(1.6±0.15)

.31±.006(0.8±0.15)

0805(2012)

.08±.008(2.0±0.20)

.05±.008(1.25±0.2)

1206(3216)

.126±.008(3.2±0.20)

.063±.008(1.6±0.20)

Size

T(Thickness)

M(Width of the termination point)

0402 (1005)

.024max(0.60max)

.004min(0.10min)

0603(1608)

.037max(0.95max)

.004min(0.10min)

0805(2012)

.05max(1.25max)

.006min(0.15min)

1206(3216)

.063max(1.60max)

.008min(0.20min)

Technical Spec.
Rated zero-power resistance (R25?) 0.2KO ~ 1000KO
Allowable tolerance (R25?) ±1%, ±2%, ±3%, ±5%, ±10%
Range of B value (K) 3200K ~ 4700K
Allowable tolerance of B value ±1%, ±2%, ±3%
Dissipation factor (in still air) --
Operating temperature (?) -30? ~ 125?
Thermal time constant (in still air) --
Configuration Chip
Exterior size 0402; 0603; 0805
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