1. Characteristic:
·Miniature size
·No lead, ideal for high density SMT installation
·Superior solder ability and resistance to soldering heat
·Ideal for wave or reflow soldering
2. Application:
·Temperature compensation of IC, LCD, transistor, crystal
oscillator of mobile communications equipment
·Temperature sensor for rechargeable batteries
·Temperature sensor for CPU
·Temperature compensation for several kinds of circuits
3. Dimension:
Size
|
L(Length)
|
W(Width)
|
0402 (1005)
|
.04±.006(1.0±0.15)
|
.02±.004(0.5±0.10)
|
0603(1608)
|
.063±.006(1.6±0.15)
|
.31±.006(0.8±0.15)
|
0805(2012)
|
.08±.008(2.0±0.20)
|
.05±.008(1.25±0.2)
|
1206(3216)
|
.126±.008(3.2±0.20)
|
.063±.008(1.6±0.20)
|
Size
|
T(Thickness)
|
M(Width of the termination point)
|
0402 (1005)
|
.024max(0.60max)
|
.004min(0.10min)
|
0603(1608)
|
.037max(0.95max)
|
.004min(0.10min)
|
0805(2012)
|
.05max(1.25max)
|
.006min(0.15min)
|
1206(3216)
|
.063max(1.60max)
|
.008min(0.20min)
|